Tantalum sputtering targets (Ta target, tantalum sputter target) 
Grade :  3N, 3N5, 4N, 4N5 with Ta 99.95%min
Chemical composition   : 
                Ta                  99.95   %min
                O                   0.0100  %max
                C                   0.0040  %max
                N                   0.0040  %max
                H                   0.0010  %max
                S                    0.0001  %max
                Al                   0.0005  %max
                Ca                  0.0005  %max
                Cd                  0.0005  %max
                Cl                   0.0005  %max
                Co                  0.0005  %max
                Cr                   0.0005  %max
                Cu                  0.0005  %max
                Fe                  0.0005  %max
                Hf                  0.0005  %max
                K                   0.0001  %max
                Li                   0.0001  %max
                Mg                  0.0005  %max
                Mn                  0.0005  %max
                Mo                  0.0050  %max
                Na                  0.0001  %max
                Nb                  0.0400  %max
                Ni                   0.0005  %max
                Pb                  0.0005  %max
                Si                   0.0005  %max
                Sn                  0.0005  %max
                Ti                   0.0005  %max
                Th                  0.0050  %max
                V                    0.0005  %max
                W                   0.0150   %max
                Zn                  0.0005  %max
                Zr                   0.0005  %max
                Y                    0.0005  %max
                U                    0.0050  %max
                Others (each) : 0.0005  %max
Total metallic elements :   0.05%max
Recrystallization           :   95%min
Grain size    :  ASTM 4 or finer
Surface finish: 32Rms max. or Ra 0.4 ( RMS64 or better)
Flatness       : 0.1mm or 0.15% max.
Tolerance     : +/-0.010" on all dimensions 
Size available :
- Flat tantalum targets, rectangular tantalum target): 
1mm up to 12.7mm Thickness x Width up to 600mm x Length up to 1800mm (.040" to 0.50" thick x width up to 23.62" x length up to 70");

- CircularTantalum targets :
25mm up to 650mm Diameter x 3mm up to 25.4mm Thickness (1" to 25" diameter x 0.1181" to 1" thickness)

The material is available as follows :
- R05200, unalloyed tantalum, electron-beam furnace or vacuum-arc melt, or both,
- R05400, unalloyed tantalum, powder-metallurgy consolidation,
- R05255, tantalum alloy, 90 % tantalum, 10 % tungsten, electron-beam furnace or vacuum-arc melt, or both,
- R05252, tantalum alloy, 97.5 % tantalum, 2.5 % tungsten, electron-beam furnace or vacuum-arc melt, or both, and
- R05240, tantalum alloy, 60 % tantalum, 40 % nobium, electron-beam furnace or vacuum-arc melt.
Typical Size & Application: The popular geometries of tantalum sputtering target are available with both planar sputtering targets and rotatable sputtering targets, such as tantalum circular, tantalum rectangular, tantalum ring, tantalum tube, tantalum cylinder(cylindrical targets) and tantalum conicity, etc.,  we can meet your unique requirements on tantalum sputtering targets no matter in density, purity, homogeneity or in geometry of the sputtering target for the thin film industry.

50.8mm diameter x 3.175mm thickness  ( 2" dia X .125"  thk), purity 3N8
50.8mm diameter x 6.35mm thickness    ( 2" dia X .250"  thk), purity 3N8
101.6mm diameter x 3.175mm thickness( 4" dia X .125"  thk), purity 3N8
101.6mm diameter x 6.35mm thickness  ( 4" dia X .250"  thk), purity 3N8
127mm    diameter x 3.175mm thickness( 5" dia X .125"  thk), purity 3N8
127mm    diameter x 6.35mm thickness  ( 5" dia X .250"  thk), purity 3N8
152.4mm diameter x 3.175mm thickness( 6" dia X .125"  thk), purity 3N8
152.4mm diameter x 6.35mm thickness  ( 6" dia X .25"  thk),   purity 3N8
215.90mm(+/-0.254) diameter x 6.35mm(+/-0.254) thickness or 8.5" diameter x 0.25" thickness with tolerance: +/-0.010" on all dimensions.  Surface finish: Ra 1.6 to 0.8 micron

254mm(+/-0.254) diameter x 6.35mm(+/-0.254) thickness or 10" diameter x 0.25" thickness with tolerance: +/-0.010" on all dimensions.   Surface finish: Ra 1.6 to 0.8 micron

355.6mm(+/-0.254) diameter x 6.35mm(+/-0.254) thickness or 14" diameter x 0.25" thickness with tolerance: +/-0.010" on all dimensions.

304.80mm x 355.60mm x 6.35mm or 12" x 14" x 0.25" with tolerance: +/-0.010" on all dimensions.    Surface finish: Ra 1.6 to 0.8 micron.
We can tailor the sizes upon request.

Trade name:  Ta target, Ta sputtering targets, Ta targets, Ta sputtering target, Sputtering target of Ta, Flat target of tantalum,  tantalum target, tantalum targets, tantalum alloy targets, tantalum tungsten alloy targets, tantalum sputtering targets, tantalum sputtering target, tantalum sputter target, tantalum sputter targets, tantalum thin film.

Standard Specification ASTM B 708 -05 for Tantalum Ribbon, Tantalum Alloy Ribbon, Tantalum Strip, Tantalum Alloy Strip, Tantalum Foil, Tantalum Alloy Foil, Tantalum Sheet, Tantalum Alloy Sheet, Tantalum Plate, Tantalum Alloy Plate.
This specification covers unalloyed and alloyed Tantalum Ribbon, Tantalum Alloy Ribbon, Tantalum Strip, Tantalum Alloy Strip, Tantalum Foil, Tantalum Alloy Foil, Tantalum Sheet, Tantalum Alloy Sheet, Tantalum Plate, Tantalum Alloy Plate as follows:
1. ASTM B 708 -05 UNS R05200, unalloyed tantalum, electron-beam furnace or vacuum-arc melt, or both.
2. ASTM B 708 -05 UNS R05400, unalloyed tantalum, powder-metallurgy consolidation.
3. ASTM B 708 -05 UNS R05255, tantalum alloy, 90% tantalum 10% tungsten, electron-beam furnace or vacuum-arc melt, or both.
4. ASTM B 708 -05 UNS R05252, tantalum alloy, 97.5% tantalum 2.5% tungsten, electron-beam furnace or vacuum-arc melt, or both.
5. ASTM B 708 -05 UNS R05240, tantalum alloy, 60% tantalum 40% columbium, electron-beam furnace or vacuum-arc melt.

Metallic elements analyzed by GDMS, Gases (C+O+N+H) by Leco Methods.
Special Flatness Requirement for Explosive Bonding :  when specifically requested, the flatness of tantalum or tantalum alloy plate or tantalum sheet or tantalum alloy sheet to be used for explosive bonding applications shall be a maximum of 4% or 6mm per meter, which ever is less. The performance and inspection of this requirement shall be negotiated between the supplier and  the purchaser.

Tantalum Plate for Sputtering Target Applications (ASTM B 708 R05200 or ASTM B 708 R05400 only)
Tantalum Plate for Sputtering Target Applications shall meet the above chemical requirements. 99.95% MIN. purity requirements shall be supplied unless the purchaser states another purity requirement on the purchase order or contract.  (Purity refers to 100% minus total metallic elements only; gasses are omitted from the calculation.