AlSi Alloys Microelectronic Package

AlSi Alloys Microelectronic Package
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Category:Transportation / Car Parts & Components
Label:AlSi Alloys Microele
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Product Description

AlSi Alloys Microelectronic Package

Product Description

Computer CPU,DSC chips

Integrated Circuit Package Housings

Carriers

 Radar Microwave modules

Semiconductor Wafers

Electronic Communications Devices

Materials:Silicon Aluminum Alloys(AlSi Alloys)

Configuration:Platforms,Plug-ins,Flatpacks,TO Headers etc.

Advantages

CTE match to circuit boards and components;

High thermal conductivity and outstanding heat dissipation;

Low density;

Hermeticity;

Dimensional stability;

Corrosion Resistance;

Wafer Level Packaging;

Ease of manufacture.


 AlSi Alloys Performance Parameters

 Content

Density
g/cm³

CTE
ppm/

Thermal Conductivity
W/mK

Tensile Strength
MPa

Yield Strength
MPa

Poisson's Ratio

Elongation
%

  Elastic Modulus
GPa

Al-27%Si

2.6

17

175

170

130

0.29

3.8

91

Al-42%Si

2.55

13.5

160

200

187

0.29

1

105

Al-50%Si

2.5

11.5

140

220

210

0.28

<1

108

Al-60%Si

2.46

10

125

210

210

0.27

<1

111

Al-70%Si

2.43

7.5

120

135

135

0.27

<1

114

 

AlSi Alloys Microelectronic Package 1

Member Information

Tianjin Baienwei New Material Technology Co.,Ltd
Country/Region:Tian Jin - China
Business Nature:Manufacturer
Phone:15222324503
Contact:Ivy Zhang (Sales Manager)
Last Online:12 Feb, 2015