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NT3ACA9-R8-50
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Specification for Heat Sink |
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Application |
3U Server&Up,workastion&Tower desktop solution |
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CPU Socket |
LGA 2011 (Mounting pitch: 94*56mm) |
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Application platform |
Intel® Sandy Bridge EP/EX Processors E5-2600 / E5-4600 (for Narrow ILM Mounting Only) |
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Features |
1. Copper base+ Aluminum fin+5pcs U-shape Heat pipe |
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2. Bigger cooper base can absorb more thermal. |
3. 5PCS U-shape heat pipe and Aluminum fin make good cooling effect. |
4..Back plate can remove and replace, it can applied for all platforms. |
Mounting way |
Screw+ Spring |
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Size of Products |
105*95*125 mm |
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Weight |
590 g(Note:If Weight of Heat sink ≥500g,
Pls do not install in CPU in case of damage. |
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Thermally conductive material |
AD66(Thermally conductivity >4.0) |
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Back Plate |
NA |
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