RFID flip-chip bonding machinery

RFID flip-chip bonding machinery
Model:RF2000
Brand:CAINA
Origin:Made In China
Category:Industrial Supplies / Other Industrial Supplies
Label:RFID bonder , flip-chip bonder , RFID testing machine
Price: US $1 / set
Min. Order:1 set

Product Description

RF-2000 is a electronic label flip-chip assembly machine, through hot press to solidify and package, roll feeding, automatically pick and paste the chip, auto receiving system, Sophisticated pressure controlling system and tongs can improve the yield of product. It's a high technology equipment concentrated optical, mechanical, electrical, air and liquid fileds. Adaptable for different kinds of electronic label assembling.
Dimension
4800mm*940mm*1650mm
Weight
2560 kg
Power
2800 w
Barometric pressure
5 bar≤P≤7 bar
Pressure range
50—300g
Accommodated workpiece
antennna ≤100mm×80mm
chip 0.4mm×0.4mm~2mm×2mm
Temperature range
50—300 ℃
Vision system
Vision position system, chip and antenna automatically positioning
Additional function
Finished label testing system
Throughtout
2000 pcs/hr
Paster accuracy
35 μm
Substrate Material
PET   PVC   PAPER
Adhesive
ACA   NCA   ICA

RFID flip-chip bonding machinery 1

Member Information

shenzhen CaiNa Semiconductor Equipment Co.,Ltd
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:18603071612
Contact:Joney (sales manager )
Last Online:11 May, 2016

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