Main features                                                  

• Large area of infrared carbon fiber Pre-heating system, with the advantage of pre-heating fast and evenly and no light pollution.
• Temperature parameters protected by limits of authority, for avoiding error settings.
• Ten segments of temperature control process, suitable for all kinds of BGA Rework.
• Unlimited storage of the temperature profile, just need press one key to use the profile.
• Three K-type sensors available can realize the high precise temperature testing of each point of PCB or BGA, and PC can generate report of curves analysis automatically.
• Desoldering and soldering automatically, No need the manual adjustment
• Hot air flow can be adjustable to meet the demand of any chips
• USB Connection driver-free, PC control
• The bottom hot air lifting control available in the front panel, it is convenient to adjust at any time.
• Laser positioning available, to make the positioning faster.