Application

1. LED lighting
2. LCD TV / Set Top Box /
3. IT: M/B, NB, Video, Card
4. Power: Power module / power transistor
5. Memory: DDR3-DIMM / SO-DIMM / SSD
6. Network: AP / Route / ADSL / Modern, S/W
7. Components: ICS / chipsets / CPU / MOS / South Bridge

Outstanding Features

1. Small size, light weight, less space, more conductive to the reasonable layout of product design.

2. Good heat dissipation and heat transfer performanceof electronic products, which can effectively solve the problem of heat dissipation on power components, and also extend the service life of the product.

3. Withstand high current, high voltage, leak-proof on electrical breakdown, no noise and will not produce coupling parasitic capacitance with MOS, more condnuctive to design, and pass the electrical certification

4. Sic ceramic with good insulation, high thermal conductivity, high infrared emissivity, and low coefficient of thermal expansion, which can be a new naterial for heat dissipation of LED lighting and internet communications products.

5. With microporous structure and the feaure doesn’t store heat, it has more than 30% porosity compare with the same area of other products. At the same time, it the heat dissipation of sic ceramic is omni-directional , and more suitable for the omni-directional heat dissipation of IC’s packing.

Sic Ceramic

Sic ceramic is a kind of eco-friendly product. With the features of microporous strucutre, it can be more than 30% porosity compared with the other products in the same area, which greatly increase the heat radiation and enchance the heat radiation effect. And at the same time, it has a small heat capacity, so the heat can be transferred to the outside world more quickly. The main characters of the ceramic are as follows: eco-friendlt, insulation, resistance to high pressure, high thermal conductivity, and avoiding EMI problems.

Sic ceramic is mainly used in network communication products, flat-panel TVS, driving power and related electronics industry which can effectively solve the problems of heat conduction and heat dissipation in electronics and household appliances. It is particularly suitable for the products which are light, thin, small designed, and with small and medium-sized watts power consuption. It can provide technical support and application for the innovotion and development of electronic products.