1.Drawing format: Protel 98 or 99 or 99 SE/Protel DXP or DXP 2004/Allegro/Power PCB/CAM 350/Gerber(favorite) ;

2.Layer: single/double/four/six/eight/ten/twelve/fourteen/sixteen/eighteen/twenty…… ;

3.Copper thickness(I/O): 18um/0.5oz、35um/1oz、70um/2oz、105um/3oz、140um/4oz、175um/5oz、210um/6oz;

4.Laminate type: FR4 /IT180A/ FR4(halogen-free)/FR4 (halogen-free)＋high-Tg/Rogers/Arlon/Tyconic/Nelco…… ;

5.Board thickness: 0.2mm/0.5mm/0.7mm/0.8mm/1.0mm/1.2mm/1.5mm/1.6mm/2.0mm/2.4mm/3.2mm/6.4mm ;

Note: (1) If no special requirement for structure or no impedance requirements, the board thickness will be finished with1.6mm commonly; and if more than 14 layers, the board thickness should not be less than 1.6mm.

(2)If without notes, the tolerance of board thickness will be not more than ±10%.

6.Surface finish: HASL/HASL(lead-free)/Immersion Sn/Immersion Au/Immersion Ag/Au plated/OSP…… ;

7. Solder mask: solder resist ink/blue gel/carbon ink print;  Color: Green(light/matte)、Black、White、Yellow、Blue、Red ;

8. Silkscreen legend: White/Yellow/Black;

Note: If green soldermask, the legend will be printed in white; if white soldermask, the legend will be black.

9.Min diameter of Via hole: mechanical hole-6mil/laser drilling-4mil; maximal capability:1:10(thickness-diameter ratio);

10. Soldermask for via hole: (1) PCB design request,(2) Cover holes by soldermask,(3) Clogging, (4) plug for via hole of BGA;

11.NPTH: If any NPTH, pls mark the NPTH;

12. LOGO and lead time: If no customers demand, manufacter's LOGO and time will be as the default.

13. Chamfer of goldfinger: Corner cut processing: 20°、30°、45°……, please note the depth and the angular;

14. Panel drawing: pcs/set; If the dimension of each pcs between 50mm×50mm and 125mm×150mm, we advice to adopt delivery in unit of "set(A*B)"; and if more than 200mm×165mm, deliery in unit of "pcs" will be popular;

15. plate edge procesing: there are two cases that we advice to add 5mm width edge in each length direction: (1) if the printed board will be undergone the reflow soldering, and the distance between components and plate adge is less than 5mm;

(2) if the printed board will be undergone the wave-soldering, and the distance between components and plate edge is less than 3mm.

16. Acceptance Criteria: (1) Based on the customers demand; (2) IPC-A-600G; if no special requirement, the Ⅱ grade standard

will be the default criteria.

17. Test: E-test、Impedance test、Hi-pot、Solderability test、Thermal stress test、Insulation resistance test;

For any matters not mentioned herein, please feel free to contact us!