Packaging & Delivery

Introduction: 

This pull bonder tester is designed for testing the pull strength of the wire bonded on the chip and the push strength of the gold ball on the chip and the die bonding strength(COB). 

Specification:

• Dimension:350mm*400mm*500mm
• Power in:220V
• Power:5W
• Microscope:15/30X OR 20/40X                              
• Push strength range:0-5000G(accuracy: 0.001KG)Meter brand:SP
• Pull strength range:0-30G(accuracy:1G)Meter brand:DESK
• Jig:depend on product(standard jig: COB, DIP,SMD,High power LED)
• Precision lead screw:stroke:200MM                                       
• Micrometer:0-25MM(2 pcs)
• Precision slide:4PCS
• Weight:30kg                        

Operation:

1,put the product to the jig; 

2,adjust the meters to zero;

3, under the microscope, turn the hand wheel slowly, so to push the product to close to the meters;

 4, align the probe or hook on the meter to the gold ball or wire. 

5, turn the micrometer slowly, the meter can get a value of the strength. be careful of the strength range of the meter!

Tester Details:

related produt:

aluminum wire bonder: http://minder-hightech.en.alibaba.com/productgrouplist-802631915/Wire_Bonder.html

gold ball bonder: http://minder-hightech.en.alibaba.com/productgrouplist-802631915/Wire_Bonder.html

automatic die bonder: http://minder-hightech.en.alibaba.com/productgrouplist-802629393/Die_Bonder.html

LED & IC package industry: 

http://minder-hightech.en.alibaba.com/productgrouplist-802633340/LED_IC_Package_Industry.html