Model: | MD-Etech1850 |
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Brand: | MINDER |
Origin: | Made In China |
Category: | Electronics & Electricity / Electronics Stocks |
Label: | k&s wire bonder , wire bonding machine , asm wire bonder |
Price: |
US $1
/ pc
|
Min. Order: | 1 pc |
Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.
And the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).
The most competitive 4 types:thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire);Wire wedge bonder MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for samll quantity production, school,institution,research department.
Click here to view all product.
1: Automatic aluminum wire wedge bonder MD-Etech1850:
Specification:
Application: LED,COB,Integrated circuit,Semiconductor
Wire diameter:0.7mil-2.0mil
XY travel:4’’*4’’
Z travel:0.4’’
Resolution:0.02mil
Bonding angle:30 degree
Bonding force:15-200g
Bonding power:0-2w
Bonding time:programmable
Bonding head clearance:4.8mm
UPH:14K(based on 2mm wire length)
Alignment Reference:
Die: 0.1 or 2 points;Substrate:0.1 or 2 points
Image recognition system
Optical microscope:10-30X
Voltage:110v/220v 50Hz
Power:800w
Program storage:1000wires/chip,1000chips/program,99programs
Dimension:760*820*1450mm
Weight:280kg
2, Automatic ball bonder MD-S800
Character:
Application:IC(SOP,SOT,DIP,BGA,COB),LED(SMD,COB,High power,Integration)
Bonding principle: ultrasonic.
System:windows XP based.
Min wire diameter:0.5mil.
Language:Chinese/english
Wire material:gold/copper/alloy/silver.
Specification:
Bonding speed:50ms/wire
Bonding accuracy:+-3.0um
Wire length:Max:8mm
Wire diameter:15-50um
Bonding area:56-65mm
Bonding type:single wire/BSOB/BBOS
XY resolution:0.1um
Transducer system:138khz
PR accuracy:+-0.37um(4x),+-0.74(2x)
Applicable magazine:
L:120-305mm W:45-98mm H:50-180mm
Magazine pitch:Min:1.4mm
Applicable lead frame:
L:100-300mm W:40-90mm T:0.1-1.3mm
Voltage:190-240V 50Hz
Compressed air:0.6-0.97bar
Air consumption:80L/min
Dimension:1230*940*1660mm
Weight:800kg
3:Automatic heavy wire bonder MD-CWX-3710:
The main technical specifications:
Power supply: 220 vac plus or minus 10%, 50 hz, reliable grounding, maximum rate of about 800 w
Drive source: 4 ~ 6 kg/C m²
Ultrasonic power: 0 ~ 30 w, one, two welding automatic switching
Weldable aluminium silk diameter: 125 ~ 500 um (5 ~ 20 mil)
Welding time: 10 ~ 500 ms, 2 channel
Welding stress: 30 ~ 1200 g, 2 channel
Welding speed: about 1300 ~ 1300 / h (TO - 220 double)
Welding Angle: - 90 ~ 90 degrees
The visual system: PR microscope magnification of 0.5 times
PR floodlight: white light, brightness is adjustable
Shape size: 1260 mm * 1860 mm * 760 mm
Weight: 480 kg
Click here or below popho to see more kind of bonders:
Packaging & Shipping
ABOUT PACKAGING:
First we use foam and paper package,and second we use plywood box to cover, ensure there willl be no
injury during delivery. as below:
ABOUT SHIPPING:
First, usually we quote an EXW price, the shipping method should be discussed. we have tried fast forward
as DHL, and have tried by air, and by land to Russia, also by sea. also we are glad to support customer's own
forwarder.
company introduction
Guangzhou Minder-Hightech Co.,Ltd(main web page: minder-hightech.en.alibaba.com/www.minder-hightech.com) is focused on connection(welding).
We are comprised by a group of high educated specialists,with the leader of overseas professor, some of us have more than 20 years welding experience,our goal is to provide high performance product but low price and exceeded service.
We care for the safety of operator, this year, we developed a safety system in spot welding industry named SOFT TOUCH system,which can prevent heavy pinch point injury.
We are specialized in most of the connection(welding) technics,the most application we have participated in are electronic component(resistance,capacitor,inductor),chip on board,automotive electronic accessories,cell phone,IC cards,motor armature commutator etc.By material, we have engaged in connecting the Aluminum, Copper, Brass, Au(gold), Platinum, Nickel, Enameled wire, etc.
We also provided the full IC package line; and LED producing line; Crystal oscillator producing line; as well as the wafer machining equipment.
Our product are classified into resistance spot welding,inverter seam welding, ultrasonic wire bonding,hot bar soldering,automatic TIN soldering,stud welding, all the product are with mature latest technology,high performance,high precision,and high reliability.
At the same time, we maintain a good relationship with the high school scientific research institution,we know the newest connection(welding) technology direction all over the world, committed to give out the best connection(welding) solution to our global customer.
We chose the most open and industrialized city-guangzhou-to be our base head place,to ensure the efficiency and rapidly response.
These years,we proud of our growth with the famous company such as TPT,K&S,ASM,Bosch,Miyachi,Uniteck,Avio,Apollo,LPKF etc.
Guangzhou Minder-Hightech Co., Ltd | |
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Country/Region: | Guang Dong - China |
Business Nature: | Manufacturer |
Phone: | 15813334038 |
Contact: | Minder Hu (sales manager) |
Last Online: | 15 Jul, 2016 |