Structure and characteristics            

　　The device applies the spliced unit heat transfer blocks. The heat transfer blocks are sealed via teflon O-ring or inflated PTFE. The pressure spring is installed on the device as a whole to serve as the automatic compensation mechanism for thermal expansion.     

Structure and characteristics            

　　The device applies the spliced unit heat transfer blocks. The heat transfer blocks are sealed via teflon O-ring or inflated PTFE. The pressure spring is installed on the device as a whole to serve as the automatic compensation mechanism for thermal expansion.     

Structure and characteristics         

Material system:design pressure: 0.4MPa; design temperature: -20-165℃;

Cooling system: design pressure: 0.4MPa; design temperature: -20-165℃;

　　Specification of device: 1-400m²; We can, as per user’s needs, design and manufacture device with pressure of 0.7MPa and temperature of 200℃, as well as heat exchanger of over 400m².