FR4 Heavy Copper PCB Printed Circuit Boards

FR4 Heavy Copper PCB Printed Circuit Boards
Model:one-7
Brand:ONE
Origin:Made In China
Category:Electronics & Electricity / Electronic Components / Integrated Circuit
Label:heavy copper pcb , high frequency pcb , thickness pcb
Price: -
Min. Order:1 pc
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Product Description

FR4 Heavy Copper PCB Printed Circuit Boards

Quick detail:(oneseine)

Material

Cooper Clad Laminate

Board Thinckness

1.2mm

Layer

Double sided

Size

15*20cm

Color

Green

Surface Finish

Hasl

Solder Masker

Black

Copper Thinckness

1 Oz

Copper Clad FR4 is an excellent material commonly used for Printed Circuit Board (PCB) fabrication.  The fiberglass substrate is a flame retardant (FR4) laminate, typically translucent in color and made of a continuous fine weave woven glass cloth.  The fiberglass cloth is then impregnated with epoxy resin, and the copper foil material is adhered through an electroplating process.  The copper is measured in microns or ounces per square foot and measures .00134" thick per ounce or 34.1 microns. 

Heavy Copper PCB General Info

Heavy Copper Board does not have a set of definition per IPC. According to PCB industry, however, peopel generally use this name to identify a printed circuit board with copper conductors 3 oz/ft2 - 10 oz/ft2 in inner and/or outer layers. And Extreme heavy copper PCB refers to 20 oz/ft2 to 200 oz/ft2 printed circuit board

Heavy copper normally used for a various products but not limited to: high power distribution, heat dissipation, planar transformers, power convertors, and so on

Design Guide for Heavy Copper PCB

Typical conductor width/spacing/thickness tolerance is +/-20%, although tighter tolerance is achievable.

The minimum width and thickness of a heavy copper PCB conductor is determined primarily on the basis of the current carrying capacity required and the maximum permissible conductor temperature rise.

A circuit board trace, depending on its size and manufacturing process, may not be rectangular in shape. Heavy copper conductors can significantly add to the overall board thickness.

Additive (plating) processed are preferred to subtractive (etching) processes but are more expensive).

 

Copper Clad FR4 is an excellent material commonly used for Printed Circuit Board (PCB) fabrication.  The fiberglass substrate is a flame retardant (FR4) laminate, typically translucent in color and made of a continuous fine weave woven glass cloth.  The fiberglass cloth is then impregnated with epoxy resin, and the copper foil material is adhered through an electroplating process.  The copper is measured in microns or ounces per square foot and measures .00134" thick per ounce or 34.1 microns. 

Copper Clad PC Boardscan be clad double-sided or single-sided.  The copper is commonly available in ½ oz, 1 oz, and 2 oz weights, although heavier weights are available.  Copper can be clad up to 6 ounces while still maintaining a very strong dielectric strength. The G10 FR4 material substrate can be made in black, blue or red for high end optical applications or aesthetic applications.   

In addition to some of the standard sizes like .062 thick PCB and .032 thick FR4 PCB, we offer thin film clad material.  We can make the material as small as 4 mil and 5 mil (.004" - .005") as a core thickness for the G10 FR substrate. 

Another option for the copper clad laminate is our Ultraviolet (UV) Blocking chemical that we can add to the FR4 that blocks out the full spectrum of light up to 405 nm. 

We offer a High-temperature copper clad laminate in FR5 compliant to  IPC 4101/23 for more sophisticated circuitry.  The High Temp clad material has a higher thermal range for use in high frequency and burn-in boards.  

There are many applications for the copper cladding on the G10 material such as :  Antennas, RFI/EFI and Microwave products that need a low dissipation factor. Broadband, Telecom, Consumer Electronics ... just about everywhere electronic circuits are needed.

 

PCB Capability

 Layer

1-30L

 Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate.

 Board Thinckness

0.2-6mm

 Max Finish Size

800*508mm

 Min. Drill Hole Size

0.25mm

 Min. Line Width

0.075mm(3mil)

 Min. Line Spacing

0.075mm(3mil)

 Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP

 Copper thickness

0.5-4.0 Oz

 Solder mask color

green/black/white/red/blue/yellow

 Inner packing

Vacuum packing, Plastic Bag

 Outer packing

 standard carton packing

 Hole tolerance

PTH:±0.076,NTPH:±0.05

 Certificate

ISO9001,SGS

 Profiling punching

Routing,V-CUT,Beveling

 

FR4 Heavy Copper PCB Printed Circuit Boards 1

Member Information

Oneseine Technology CO.,LTD
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:18682010757
Contact:Tracy Yao (sales manager)
Last Online:03 Sep, 2018