The material is heat reinforced polymer, designed to meet the Thermal conductivity and reliability demand for the thermal conductivity of high application terminal. In addition, the heat sink’s performance benefits a lot from the low heat resistance. And improve the microprocessor,DC - DC converter of memorymodule and the reliability of power module.The phase change characteristics: the materialissolidinroomtemperatureandinstallationiscompletelyconvenient， usedbetweenheatsinkanddevices.Thematerial canbesoftened and flowing when the productsreachphase-change temperaturetofillthe devices’tinyirregular contactsurface. Thus, the material has the ability to fill the gap between the devices and heat sink completely, make the phase change better than non-current elastomersor thermal graphite pad and get the performance of thermal conductive silicon grease. The material is nonconductive, however, as the material has endured the phase change at high temperature, may make the metal get to the metal, so the phase change interface material can not be used as electrical insulating material. 

Features & benefits:

• Low heat resistance und low stress
• Flowing but not silicone oil
• No radiator preheating
• Low volatility—less than 1%
• Self-adhesive , easy to use

physical properties: