PUR hot melt adhesive for mobile device assembly

Model:	PUR6302
Brand:	WEILICHI
Origin:	Made In China
Category:	Chemicals / Adhesives & Sealants
Label:	PUR adhesive syringe
Price:	US $15 / PC
Min. Order:	300 PC

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Product Description

PUR hot melt adhesive for mobile device assembly

PUR hot melt adhesive for bonding of all kinds of plastic and metal substrate in electronics and micro electronics industry.Mainly for substrates of digital products such as mobile phone, tablet, mobile power pack, laptop, MP3 player, PCB etc.

Advantages:

1. Good high temperature resistance, damp and heat resistance, chemical corrosion resistance

2. High peel strength

3. Good adhesion to variety of substrates.

Application:

1.PUR6302 for bonding of plastic substrate in electronics and micro electronics industry.

2.PUR6301 for bonding of all kinds of substrate in electronics and micro electronics industry .

Model	Appearance	Melting viscosity	Open time	Operation temperature	Application
Model	Appearance	mPa.s	second	°C	Application
PUR6302	white solid	8000±500/120°C	360	110~130	good adhesion to various of plastic materials, suitable for bonding of plastic substrate in electronics and micro electronics industrial.
PUR6301	white solid	6000±500/110°C	90	110~130	mainly used for bonding of all kinds of substrate in electronics and microelectronics, such as ABS, Makrolon, Fiber Reinforced Plastics, polyester, acrylic, gel coat, epoxy resin, PVC, aluminium alloy, stainless steel, copper, steel alloy etc.