Electroplated bond diamond  blade with hub


Electroplated bond diamond  blade with hub is our high level product, which is used to groove, cut, and dice silicon, GaAs, glass, ceramic, quartz  and compound semiconductor material wafer in integrated chiops and discrete devices production. This product has high precision and long life span.Its performance has achieved abroad advanced level.



Application



Silicon, GaAs, glass, ceramic, quartz  and compound semiconductor material wafer in integrated chiops and discrete devices production.





Main Features



1.High precision and easy to use.


2.Long life span.


3.Good cosst performance.


4.High efficiency and good surface quality. 





Specification









  












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