Feature:

 

 High thermal performance , high reliability;

High compressibility, soft and flexible;

National viscosity, do not need surface adhesive;

Meet the environmental requirements of ROHS and UL.

 NOTE: 0.3mm-10.0mm/0.11-4.0inch

 

Application :

 

 

 Between circuit board and heat sink  

 Filing the interface  between IC and heat sink or housing 

 Filling the interface  between IC and  heat sink material 

 Between  Aluminum PCB and  housing 

 

 

 More Description:

 

 

Available to custom and die-cut to meet your need

Standard size:

200mm*400mm,300mm*400mm (Available to customize and die-cut ) 

Standard thickness:(Available dimension range from 0.10 inch to 4.0 inch)

 

0.3mm,0.5mm,1.0mm,1.5mm,2.0mm,2.5mm,3.0mm,3.5mm,4.0mm,4.5mm,5.0mm, 5.5mm,6.0mm,6.5mm,7.0mm,7.5mm,8.0mm,8.5mm,9.0mm,9.5mm,10.0mm    (Please contact us for other thickness). 

 

According to customer requirements custom any color
Reinforced Stickiness:

HC100 have natural sticky,replace screw or fastener when bear one-sided adhesive or adhesives

Reinforcement: thickness less than 1.0mm,(0.3\0.5mm) available to glass-fiber reinforced, thermal pad easy to assembly.