High Density Interconnect PCB

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General Information for High density pcb (HDI PCB)

HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb.An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. 
HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.

High Density PCB is used extensively in applications and industries including:

● Cell phone	● GPS
● Telecom	● ASemiconductor
● Automotive	● Military
● Medical	● Instrumentation

 

1. 6L HDI printed circuit board for Intercom

6L High density PCB (HDI PCB) for intercom
Board dimensions: 110 x 166mm
Finished board thickness: 1.2mm
Material: FR-4 Tg150
Minimum holes size: 0.1mm
Minimum line width/clearance: 3.5/3.5mil
Copper thickness: 1oz
Solder mask: top and bottom (color: green)
Silkscreen: top (color: white)
Finish: immersion gold (top and bottom)
Board stack up: 1 + 4 + 1

2. 6 Layers HDI PCB

6L High density PCB (HDI PCB) for intercom
Board dimensions: 80 x 120mm
Finished board thickness: 1.0mm
Material: FR-4 Tg150 halogen free
Minimum holes size: 0.1mm
Minimum line width/clearance: 2/3mil
Copper thickness: T oz (12um)
Solder mask: top and bottom (color: Blue)
Silkscreen: top (color: white)
Finish: immersion gold (top and bottom)
Board stack up: 1 + 4 + 1

3. 8L Cell phone HDI board PCB

8layers High density PCB (HDI PCB) for cell phone
Base material: FR4, Tg150
Layer count: 8 layers (HDI PCB)
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.075mm
Minimum line spacing: 0.075mm
Laser drilling + blind and buried drilling Impedance control
Stack up: 1+6+1 

4. 10L High density printed circuit board

10layers HDI PCB
Base material: FR4, Tg170
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.1mm
Minimum line spacing: 0.1mm
Laser drilling + blind and buried drilling Impedance control
Board stack up: 1+8+1
Impedance control 

5. 10L High Density Interconnect pcb

10L High Density Interconnect board
Laminate: FR4, Tg150
Board thickness: 1.6mm
Copper thickness: 17.5um (Hoz) for all layers
Solder resist: green color
Surface Finish: Immersion gold
Trace width/width: 0.89/0.1mm
Min. holes:0.1mm
Controlled Impedance
Board stack up: 1+1+6+1+1
Application: Industry control

 

6. 10L stage 2 Automotive HDI PCB

Layer count: 2 stage 10 layer
Board thickness：1.0mm
Dimension：160*130mm
Raw material：FR4 EM825
Copper thickness on the board surface：≥35um 
Copper thickness in the hole barrel：20um
Min.line width/space：0.075mm
Minimum hole diameter：0.1mm 
Surface finishing：immersion gold≥2u"
Application：automotive driving recorder 

 

 

7. 10L every layer interconnection(ELIC) HDI PCB

Layer count:  10 layer
Board thickness：0.80mm
Raw material：FR4 370HR
Min.line width/space：0.075/0.075mm
Minimum hole diameter：0.10mm 
Surface finishing：ENIG
Plug via-in-pad by resin and plate flat