Application:

1. Bonding(infrared thermal rector,IGBT,thermal printer head, integrated module,semiconductor module,power mould etc)

2. Temperature sensor,medical measurement

3.Home appliance/ smart home, solar home appliance,etc

4. Automotive air conditioner and engine, etc

Feature:

1.Adopt silver electrode, high performance

2.Gold/ silver wire bonding

3.High stability&reliability

4.Small size,fast response

5.Accuracy reaches to ±1%

6.Suitable for all kinds of encapsulation

7.Customized sizes and parameter are available