Lms-STF series   heat pressed silicon rubber sheet

 

Product features:

1.Extremely high heat transfer, heat resistance and buffer.

2. Not to FPC, Glass and other damage.

3. The heat has super stable characteristics and the pressure on the product consistency.

4. High resilience and non-stick.

5. Antistatic, no powder on the surface.

 

Product specifications:

1, (thick:0.2mm--0.45mm) * (width:8mm-600mm) * (length:5-30m).

2, special specifications can be customized according to customer demand, and provide our customers customized various specifications of the iceberg.

3, the products are divided into common type SG (gray) and anti-static SGB (black).

4, the product is commonly used inside diameter 32mm, 38mm, can be customized according to customer demand.

 

Product application:

COG/FOG hot pressing bonding process for various display screens, ACF conductive film hot pressing, etc..

 

Product application: 

application of various display COG\FOG hot state fixed process, or for transistor, IC and other electronic semiconductor products for insulation material, heat dissipation material use, or application in electric regulator and a temperature sensor, the advance on the bottom surface of the hot pressing head, the conduction temperature more uniform, the isolation is pressing products and head, and can prevent electrostatic isolation protection role.

 

Specifications:

Thickness:0.2mm~0.45mm

Width:8mm~600mm

Length:5m~30m

Size：Customer Size Accepted

Packaging Details:As customer requried

 

Color:Grey and Black

Hardness(Shore A):75~80

Surface：Matte

Use Temperature(℃)：-60~320

Volume Independence(Ω.cm)：10^8--10^12

Thermal Conductivity(w/mk):0.5~0.73

Elongation(%):165~180

Tensile Strength(Mpa):6.0~7.3

Compression(Max%):26~30