High Frequency Teflon 2 Layer Black OSP F4B PCB Boards

High Frequency Teflon 2 Layer Black OSP F4B PCB Boards
Model:ONE-17
Brand:ONESEINE
Origin:Made In China
Category:Electronics & Electricity / Electronic Components / Circuit Board
Label:High Frequency PCB , Teflon PCB , Taconic PCB
Price: US $18 / pc
Min. Order:1 pc
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Product Description

High Frequency Teflon 2 Layer Black OSP F4B PCB Boards

 

PCB boards introduction:

Material

F4bM

Copper

1OZ

Layer

2

Size

2*3CM

Surface finish

OSP

Solder mask

Black

Thickness

1.6mm

Min line

5mil

 

F4B Laminate:

F4B-1/2 is laminated with excellent material according to the requirements of microwave circuit in electrical performance. It is a kind of laminate of microwave PCB due to its excellent electrical performance and higher mechanical strength.

Teflon woven glass fabric copper-clad laminates with high permittivity

F4BK-1/2

F4BK-1/2 is laminated by laying up of varnished glass cloth with Teflon resinaccording to the scientific formulation and strict technology process. This product takes some advantages over F4B series in the electrical performancewider range of dielectric constant.

Teflon woven glass fabric copper-clad laminates with high permittivity

F4BM-1/2

F4BM-1/2 is laminated by laying up of varnished glass cloth with Teflon resinaccording to the scientific formulation and strict technology process. This product takes some advantages over F4B series in the electrical performancewider range of dielectric constantlower dielectric loss angle tangentincreased resistanceand more stability of performance.

Teflon woven glass fabric copper-clad laminates with high permittivity

F4BMX-1/2

F4BMX-1/2 is laminated by laying up of varnished glass cloth with Teflon resinaccording to the scientific formulation and strict technology process. This product takes some advantages over F4B series in the electrical performancewider range of dielectric constantlower dielectric loss angle tangentincreased resistanceand more stability of performance.Compared with the F4BMthe consistency of the laminate various properties can be insured through using the imported woven glass fabric.

Teflon woven glass fabric copper-clad laminates with high permittivity

F4BME-1/2

F4BME-1/2 is laminated by laying up of the imported varnished glass cloth with Teflon resinaccording to the scientific formulation and strict technology process. This product takes some advantages over F4BM series in the electrical performance and the passive intermodulation indicators increased.

Teflon woven glass fabric copper-clad laminates with ceramic filled

F4BT-1/2

F4BT-1/2 is a micro dispersed ceramic PTFE composite with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. This product have higher dielectric constant than the traditional PTFE copper clad laminates to meet the design and manufacturing of circuit miniaturization. Due to filling with the ceramic powderF4BT-1/2 have a low Z axis coefficient of thermal expansion ensures excellent reliability of plated through-holes. Besidesbecause of the high thermal conductivityadvantage to the heat dissipation of apparatus.

F4BDZ294

1Introduction

F4BDZ294 is a kind of Teflon woven glass fabric planar resistor copper-clad laminates with the dielectric constant of 2.94. This kind of high frequency laminates is manufactured by Teflon woven glass fabricwith low dielectric constant and low dissipation factorwith the planar resistor copper foil. It features with excellent electrical and mechanical performance. Its high mechanical reliability and excellent electrical stability is suitable for the design of the complicated microwave circuit.

Structure of the materialOne side is clad with resistor copper foiland the other side is clad with traditional copper foiland the dielectric material with Teflon woven glass fabric. The dielectric constant is 2.94.

Features of the materiallow dielectric constant and lossexcellent electrical / mechanical performancelower thermal coefficient of dielectric constantlow outgassing.

2Application scope

1Ground-based and airborne radar system

2Phased array antenna

3GPS antenna

4Power backboard

5Multilayer PCB

6Spotlight network.

Metal base Teflon woven glass fabric copper-clad laminates

F4B-1/ALCu

F4B-1/ALCuis a kind of microwave circuit metal base material based on Teflon woven glass fabric copper-clad laminateswhich is pressed with copper on one sideand aluminumcopperplate on the other side.

Teflon copper-clad laminates

F4T-1/2

F4T-1/2 is a kind of circuit laminate based on the Teflon boardwhich is compressed with electrolytic copper foilafter oxidation treatmenton both sidesand then pressed together after high temperature and high pressure. This product takes some advantages in the electrical performancelow dielectric constantlow dielectric loss angle tangent. It is a good kind of laminate of microwave PCB due to its higher mechanical strength.

Microwave composite dielectric copper-clad substrate

TP-1/2

The advantage of design for microwave circuit using TP-1/2 here

1The dielectric constant is stable and can be optional within the range of 3~16 according to the design of circuit requirement. The operating temperature is  -100+150

2The peel strength between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate. This substrate is created to offer customers easy for circuit processinghigher pass-rate of productionand the manufacturing cost is much lower than the ceramic substrate. 

3Dissipation factor tgδ≤1×10-3and the loss has a slight variation with the rise of the frequency.

4It is easy for mechanical manufacturingincluding drillpunchgrindcutetchingetc.. For thesethe ceramic substrate cannot be compared.

A special microwave composite dielectric copper-clad substrate

TPH-1/2

 

TPH-1/2 is made of a new type of inorganic and organic materialswith special  process and compounding.

The advantage of design for microwave circuit using TPH-1/2 here

1The substrate is black. The dielectric constant is 2.65with consistent performance over broad temperature and frequency ranges. The operating temperature is  -100+150

2The peel strength between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate. This substrate is created to offer customers easy for circuit processinghigher pass-rate of productionand the manufacturing cost is much lower than the ceramic substrate. 

3Dissipation factor tgδ≤1×10-3and the loss has a slight variation with the rise of the frequency.

4It is easy for mechanical manufacturingincluding drillpunchgrindcutetchingetc.. For thesethe ceramic substrate cannot be compared.

5Due to the specific gravity lessthe remarkable characteristics of the module are weight lighter manufacturing by this substratewhich but other materials cant compare.

6Copper thickness is0.035μm

Teflon ceramic composite dielectric substrate

TF-1/2

TF-1/2 is a kind of circuit laminate based on the Teflonwhich have excellent microwave and temperature resistance performancecompound with ceramic. This kind of laminate can be comparable with the productssuch as RT/duroid 6006/6010/TMM10from Rogers Corporation in United State of America.

The advantage of design for microwave circuit using TF-1/2 here

1The operating temperature is much higher than TP-series. It is applicable to long-term operation within temperature ranger of -80+200and can be used for wave-welding and melt-back welding.

2Used for the manufacturing of the microwave and millimeter wave printed circuit board . 

3Better radiation performance30min20rad/cm2.

4Dielectric property is stable and has a slight variation with the rise of temperature and frequency.

Teflon woven glass fabric

F4B-N / F4B-J / F4B-T

This product is the raw material for the Teflon woven glass fabric copper-clad laminates. Dipping treatment of the Teflon resin on the alkali-free woven glass fabricdryingbaking and sinteringthe microwave material is formulated. This product is characterized by some featuressuch as heat-resistanceinsulationlow lossexcellent electrical performancein-adhesion. The Teflon woven glass fabric is Widely used in electronicsmotoraviationtextilechemical and food industryetc.. In the area of microwave devicesit can be used as the bond film for the manufacturing of multilayer printed circuit board.

1Type of material

1Anti-sticking Teflon woven glass fabricF4B-N

2Insulation Teflon woven glass fabricF4B-J

3Ventilated Teflon woven glass fabricF4B-T .

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High Frequency Teflon 2 Layer Black OSP F4B PCB Boards 1

Member Information

Oneseine Technology CO.,LTD
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:18682010757
Contact:Tracy Yao (sales manager)
Last Online:03 Sep, 2018