Sputtering is an advanced film material preparation technology. By the technology, ions generated by ion sources are gathered into high-speed ion flow at the accelerated speed in vacuum to impact solid surfaces, and ions are subjected to kinetic energy exchange with atoms on solid surfaces, so atoms on solid surfaces separate from targets and are deposited on the surfaces of substrates, thus forming nanometer (or micrometer) films. However, the impacted solids are raw materials deposited on the films by a sputtering method, which are called sputtering targets. Tungsten-molybdenum sputtering targets can form films on various substrates. The sputtering films are widely used as electronic parts and electronic products, such as TF-LCD (Thin Film Transitor-Liquid Crystal Displays), plasma display screens, inorganic LED displays, field emission displays, thin-film solar batteries, sensors, semiconductor devices as well as field effect transistor grids with tunable work function CMOS (complementary metal oxide semiconductor) and so on which are widely applied at present.