Micro BGA PBGA CBGA TBGA FPGA CGA LGA High layer 18L 1.5mm PCB in Communication

Micro BGA PBGA CBGA TBGA FPGA CGA LGA High layer 18L 1.5mm PCB in Communication
Model:3
Brand:-
Origin:Made In China
Category:Electronics & Electricity / Electronic Components / Circuit Board
Label:Micro PCB
Price: -
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Product Description

Application Field: Communication
Layer/Board Thickness: 18L/1.5mm
Surface Treatment: ENIG
Line/Space: 4.0/4.0mil
Smallest Hole Diameter: 0.2mm
Technical Feature: impedance control

Micro BGA PBGA CBGA TBGA FPGA CGA LGA High layer 18L 1.5mm PCB in Communication 1

Member Information

HX Circuit Technology Co.,Ltd.
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:29446392
Contact:Annie Zhang (mamager)
Last Online:26 Oct, 2018

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