Hot pressing process to form various alumina ceramic structural parts

Hot pressing process to form various alumina ceramic structural parts
Model:TC-025
Brand:Karefonte
Origin:Made In China
Category:Electronics & Electricity / Other Electrical & Electronic
Label:Alumina ceramic shap , Custom alumina ceram , Alumina ceramic proc
Price: US $1.5 / pc
Min. Order:50 pc

Product Description

Main features:
Physical properties: high insulation, electrical breakdown resistance, high temperature resistance, wear resistance, high strength;
Fire rating: US military standard MIL-F-51058 (highest level);
Typical applications: high current, high voltage, high temperature parts, IC MOS tube, IGBT power tube thermal insulation, etc.;
Certification status: natural organic matter, EU exempted products, no certified materials;
Pressure and temperature resistance: ideal thermal insulation material for high voltage and high frequency equipment below 1600 degrees;
Performance characteristics:
◆ High hardness, corrosion resistance and high electrical insulation performance. Excellent wear resistance, high thermal conductivity and high temperature resistance. Light weight, high density; wide range of applications.

Product main application:
Alumina ceramic sheets are mainly used in high-power equipment, IC MOS tubes, IGBT chip-type thermal insulation, high-frequency power supply, communication, mechanical equipment, high-current, high-voltage, high-temperature and other products that require thermal conduction and thermal insulation.
Physical properties: high thermal conductivity, high voltage resistance, high temperature resistance, wear resistance and high strength.
Product specifications:
Conventional models: TO-220, TO-3 P, TO-264, T0-247.
Conventional thickness: 0.28mm~3mm Conventional size: 14mm*20mm 17mm*22mm 20mm*25mm 22mm*28mm 22mm*30mm 50mm*50mm 114mm*114mm 139mm*190mm, etc. The rest of the non-standard products can be customized for drawing processing.

Application areas:
Thin film metallization substrates are widely used in hybrid integrated circuit interconnect substrates, microwave devices, optoelectronic communications, sensors, MCM and other fields. Including optoelectronic device substrate, ceramic carrier, laser carrier, chip capacitor, chip power divider, sensor, interdigital capacitor and spiral inductor.
Third, the size
1mm * 22mm * 17mm / 1mm *20mm*25 mm / 1mm*22mm*28mm / 0.38mm.5mm1mm.6mm1.5mm*120mm*120mm / 0.5mm*80mm*100mm / 0.3mm.5mm1mm1.5mm*50mm*50mm / 0.5mm*80mm*80mm
Alumina shaped parts, black zirconia, thermal aluminum nitride, special non-standard custom-made precision parts. To map processing.
 

  Shenzhen Jiari Fengtai Electronic Technology Co., Ltd.
Alumina Ceramics Zirconium Oxide Toughened Ceramics Aluminum Nitride Ceramics Silicon Nitride Ceramics Performance Table
Project Unit Al2O3 ZTA AlN Si3N4
TC-025-1 TC-025-2 TC-026 TC-027 TC-028
Material - - 96% 99% Al2O3/ZrO2 AlN SN
Color - - White Beige White Gray Gray
Density - g/cm3 3.75 3.8 4 3.3 3.22
Surface roughness Ra - um ≤0.8 ≤0.8 0.2 0.3 0.4
Light reflectance 0.3-0.4mmt % 70 70 80 35 -
0.8-1.0mmt 80 80 90 25 -
Physical characteristics Three-point bending strength
Mpa 350 400 700 450 800
Young's modulus
Gpa 330 330 310 320 310
Vickers hardness    
Gpa 14 14 15 11 15
Fracture toughness IF method Gpa.√m 3 - 3.5 3 6.5
Thermal characteristics Linear expansion coefficient 40-400°C 10-6/K 6.7 6.7 7.1 4.6 2.6
40-800°C 7.8 7.8 8 5.2 3.1
Thermal conductivity 25°C W/(m.k) 22 25 27 180 85
300°C 12 13 16 120 -
Specific heat 25°C J/(kg.k) 750 750 720 720 680
Electrical Characteristics Dielectric Constant 1MHz . 9.8 9.8 10.2 9 9
Dielectric loss 1MHz 10-3 0.2 0.2 0.2 0.2 0.2
Volume resistance 25°C Ω.cm >1014 >1014 >1014 >1014 >1014
Breakdown voltage DC KV/mm >15 >15 >15 >15 >15

Hot pressing process to form various alumina ceramic structural parts 1Hot pressing process to form various alumina ceramic structural parts 2Hot pressing process to form various alumina ceramic structural parts 3Hot pressing process to form various alumina ceramic structural parts 4Hot pressing process to form various alumina ceramic structural parts 5

Member Information

Shenzhen Jia RiFeng Tai Electronics Technology Co., Ltd.
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:13316583931
Contact:Pengcongbang (manager)
Last Online:06 Jun, 2019