Vitrified bond diamond grinding wheel features high strength, good heat resistance, sharp cutting, high grinding efficiency, no heat and block in the grinding process, small thermal expansion, easy to control accuracy. Compared with resin bond diamond grinding wheel, it solves the problems of low life, low grinding efficiency and easy deformation of the abrasives itself in the grinding process.

Vitrified bond diamond grinding wheel is widely used by the developed countries in Europe and America owing to its unique features. It is widely used for hard and brittle materials such as wafer (semiconductor wafer and solar wafer), PDC, PCD tools, CBN, tungsten steel( tungsten carbide), new engineering structural ceramics, stone, crystal, rare earth materials, magnetic materials, and etc. 

Vitrified bonded diamond grinding wheel has the features of diamond and vitrified bond.

(1)Compared with conventional corundum and silicon carbide grinding wheels, it has stronger grinding force, lower grinding temperature and smaller grinding wheel wear.

(2) It is suitable for the action of various coolants.

(3) Good shape retention, high precision of workpiece.

(4) There are more air holes in the grinding wheel, which is good for chips removal and heat dissipation during grinding, and no block and burn workpieces.

(5) Better self-sharpening of grinding wheel, long interval for dressing, easier dressing.

Therefore, vitrified bond diamond grinding wheels are used by some developed countries more and more.