Features

● Low profile space

● Ideal for automated placement

● Glass passivated chip junctions

● Low forward voltage drop

● Low leakage current

● High forward surge capability

●High temperature soldering： 260℃/10 seconds at terminals

● Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date

● Case:JEDEC DO-214AC (SMA) molded plastic body over glass passivated chi

● Terminals:Solder plated, solderable per J-STD-002B and JESD22-B102D

● Polarity:Laser band denotes cathode end