LE series thermal grease has good thermal conductive performance and reliability and can wet the surface of copper and aluminum which is extremely suit for the heat transfer of the CPU, GPU and other heating power components. As LE series has low adhesion, can fully wet the surface, form very low surface thermal resistance, it can quickly transfer the heat to cooling device. Just paste the grease on the gap between the power components and cooling device to help dismiss the air gap and enlarge the heat flow, decrease thermal resistance, reduce the temperature of power components, improve reliability and extend the usage life

Typical Applications: 

• Between Semiconductor and heatsink
• Between CPU and heatsink
• Between power resistor and base
• Thermoelectric cooler
• The surface of temperature regulator and assembly
• High-power LED lighting

• Physical Properties:

  Test Item	Test Method	Unit	LE120	LE200	LE300	LE380	LE500
  Color	Visual	-	White	White	Gray	Gray	Gray
  Specific Gravity	ASTM D792	g/cm3	2.1	2.4	3.0	3.2	3.38
  Continuous Use Temp	EN344	℃	-40~+200	-40~+200	-40~+200	-40~+200	-40~+200
  Weight Loss	@150℃240H	%	≤1.0	≤1.0	≤0.5	≤0.5	≤0.5
  Breakdown Voltage	ASTM D149	KV/mm	≥10	≥10	≥8	≥8	≥8
  Volume Resistivity	ASTM D257	Ω·cm	1×1015	9×1012	1×1013	3×1013	9×1012
  Dielectric Constant	ASTM D150	@1MHz	4.42	5.78	5.88	6.79	6.1
  Dielectric Loss	ASTM D150	@1MHz	2.05E-03	6.49E-03	3.58E-03	8.13E-03	7.67E-03
  Thermal Conductivity	ISO 22007-2	W/m·K	1.2	2.0	3.0	3.8	5.0
  Thermal  Impedance	ASTM D5470	℃-in2/W	0.150	0.050	0.015	0.012	0.009

  Standard package: syringe/pot/bucket package;

  30G/40G/1KG/5KG/10KG/20KG, customized specifications available;

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  For more , please kindly feel free to contact rita(at)szutd.com