Introduction

This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra-thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self-adhesive and never recede. No corrosion to the Copper surface, “enviromentally friendly products”.

Features

Thermal conductivity 1.2~3.0w/m·k

Ultra conformable,“gel-like” modulus

Designed for low-stress applications

low hardness

Applications

Electric vehicle battery pack

Telecommunications

Computer, Between heat-generating semiconductor and a heat sink