Solder joint thrust tester wafer thrust tester pressure strength tester compressive strength tester shear tester lead tensile tester

 

 

It is widely used in semiconductor packaging, optical communication equipment packaging, LED packaging, COB / cog process testing, material mechanics research of Military Research Institute, material reliability testing and other application fields. It is an indispensable dynamic mechanical testing instrument for bond process, SMT process, bonding process, etc. it can meet the requirements of tensile test of metal, copper wire, alloy wire, aluminum wire, aluminum strip, etc., gold ball Copper ball, tin ball, wafer, chip, SMD components, such as thrust test, tin ball, bumppin and other specific application requirements, the function can be expanded, easy to operate, accurate test University.

SGL wt20 micro solder joint thrust testing machine chip shear testing machine SMT welding element thrust testing machine

 

0.1g thrust machine chip shear force tester

 

 

1、 Technical parameters:

 

1 test accuracy

 

Thrust: 0.1g

 

Tensile force: 0.01g

 

 

2 test scope

 

Thrust: 0-500g

 

Tension: 0-300g

 

 

Inner lead tensile testing machine micro solder joint thrust testing machine chip shearing force testing machine SMT welding element thrust testing machine

 

3. Working stroke range: 70mm, resolution: 0.02mm

 

The stroke range of 4Z worktable is 50mm, and the resolution is 0.02mm

 

5 user interface: Chinese interface, English interface

 

6 operating system: control system + windows interface data operation

 

7 power supply: 200W (max300w) frequency 50 / 60Hz

 

8 weight: 35kg

 

9 size: 500mm * 550mm * 400mm

 

 

2、 The current test functions are as follows:

 

1. Inner lead tension test;

 

2. Micro solder joint thrust test;

 

3. Chip shear force test;

 

4. SMT welding element thrust test

 

5. BGA matrix integral thrust test

 

The overall system accuracy of the equipment is less than 0.1% (0.25% of the open nominal value), fully meeting any demanding IC manufacturing process requirements. It includes LED packaging industry, traditional semiconductor manufacturing industry, science and technology industry and colleges and universities.