Shanren New Materials Technology Co., Ltd. was established in 2016, with subsidiaries including Shanren (Zhejiang) New Materials, Shanren (Shanghai) New Materials, Shanren (Shenzhen) New Materials, and Shanren (UK) New Materials.

The company has successively won the titles of "High tech Enterprise", "Top 100 Enterprises in Minhang District", "Minhang District Growth Enterprise", "Minhang District Star of Science and Technology Innovation", "Minhang District A-class Taxpayer Enterprise", "Zhejiang Science and Technology Enterprise", "Zhejiang Small and Medium sized Enterprise Star of Science and Technology", etc.

Our goal is to become the world's leading brand of low-temperature electronic paste.

The company is a high-tech enterprise that integrates research and development, production, and sales. The company's R&D team is led by renowned Chinese American scientists and consists of multiple overseas doctoral and postdoctoral students. The R&D team has a master's degree or above, with R&D personnel accounting for over 40% of the company's personnel. The company is a technology driven high-tech enterprise, and is currently applying for academician workstations and postdoctoral workstations. The company focuses on product research and development, continuous improvement and optimization of product quality and production process technology, and attaches importance to the introduction and cultivation of professional talents.

The R&D department consists of R&D Department 1, R&D Department 2, and R&D Department 3. The research and development department focuses on sintered silver as the main research and development direction; The R&D department focuses on low-temperature conductive silver paste and conductive adhesive as its main research and development direction; The R&D department focuses on special adhesives as its main research and development direction. Currently applying for a postdoctoral research workstation. The company has established industry university research cooperation relations with many scientific research institutions and colleges and universities, such as Cornell University, Peking University, Weizmann Institute, Ohio State University, Fudan University, Shanghai Jiaotong University, Donghua University, University of Tokyo, Yokohama National University, National Nanoengineering Center, etc. Committed to providing environmentally friendly, high-quality, and cost-effective solutions for conductive materials, thermal conductive materials, magnetic conductive materials, insulation materials, bonding materials, etc.

The company has developed nine major platforms, including nanoparticle technology platform, metal technology platform, UV UV curing platform, resin synthesis technology platform, in-place synthesis technology platform, bonding technology platform, and film forming technology platform. Sintered silver, pressureless sintered silver, pressured sintered silver, semi sintered conductive adhesive, sintered silver film, DTS (Die Top System) pre sintered silver solder, conductive silver film, nano solder bonding material, silver glass adhesive, conductive silver adhesive, conductive silver paste, conductive silver paste, Silver nanoparticle ink, Silver nanoparticle paste, Silver nanoparticle adhesive, Silver nanoparticle paste, weldable low-temperature silver paste, tensile conductive ink, transparent conductive ink Products such as anisotropic conductive adhesive, electromagnetic shielding adhesive, thermal conductive adhesive, electronic adhesive, etc.

At present, the company has 44 authorized patents and 6 patents under application;

The two production factories of the company have successively passed TS/IATF16949 management system certification and ISO 9001:2015 quality management system certification, and their products have passed UL, TUV, CE and other certifications.

The company relies on an efficient R&D team and a "craftsman spirit" production team, advanced production equipment, reliable quality management system, and a strong marketing team, and our products and services have been widely recognized by over 1000 customers worldwide.

The company offers wide bandgap (third-generation) semiconductor packaging, hybrid integrated circuits, laser chips, semiconductor chip packaging, chiplet packaging, high-power RF devices, sensors, AI intelligence, IoT Internet of Things, IME film electronics, automotive electronics, automotive radar, flat wire motors, smart homes, smart wearables, smart clothing, MEMS modules, MiniLED, MricoLED, OLED, 5G mobile antenna, electronic paper, flexible circuits, fingerprint modules Camera module, VCM module, TP touch screen, RFID RFID tag, smart facial mask, physiotherapy electrode, high-power LED packaging, smart card packaging, LCD LCD display, sensors, optoelectronic devices, communication electronics, microwave communication, passive devices, piezoelectric crystals, Alternative fuel vehicle CCS module, aerospace, microwave, optical communication, laser infrared, electronic power, smart grid, heterojunction solar cells, We provide material solutions for welding, conductivity, thermal conductivity, magnetism, insulation, bonding, sealing, potting, coating, and three proofing in fields such as perovskite solar cells.

The company has served more than 1100 global high-end customers, and its products are exported to Finland, the Netherlands, Japan, Russia, Australia, the United States, the United Kingdom, Germany, Türkiye, Taiwan, Hong Kong, etc.