| Item |
PCB Capability |
| Laminate materials |
FR4,High TG FR4, Hign Frequency, Alum, FPC |
| Board Thickness |
0.3mm-5.0mm, Flex 0.1-0.25mm |
| Thickness Tolerance |
+-10% |
| Number of layers |
1-22L |
| Min Line Width/space |
4mil/4mil |
| Inner Layer Cooper Thickness |
0.5OZ-3OZ |
| Out Layer Copper Thickness |
0.5-4OZ |
| Hole Position Tolerance |
+-0.076mm |
| Blind Hole/Buried Plate |
YES |
| Surface Finish |
HASL, ENIG,Immersion silver,immersion tin, OSP... |
| PCB Outline |
Rectangular,Roung,Slots,Cutouts,Complex,Irregular |
| Package |
QFN,BGA,SSOP,PLCC,LGA |
| PCB Testing |
E-Test, Flying Probe test |
| Acceptable File Formate |
Gerber, Auo CAD'S, Pro-E,Ki-CAD |
| Quality Standards |
IPC-A-600F and MIL-STD-105D, China GB<4588> |
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