The communication backplane PCB is made of isola 370hr material. The communication backplane bus is a high-speed data path between the PLC host and the I / O expansion module, supporting the I / O data refresh between the host and the expansion module. The technical level of backplane bus determines the I / O expansion ability of PLC products, which is the core technology of PLC design and manufacturing.

At present, the PCB board of PLC mostly uses isola 370hr material, and PLC mostly uses serial communication technology to realize backplane bus. Compared with parallel bus, serial bus has less leads and low hardware cost, and is not easy to be interfered. Serial bus can improve the reliability of automatic equipment in harsh factory and industrial environment.

In the field of communication PCB, it is widely used in wireless network, transmission network, data communication and fixed network broadband. Related products include backplane, high-speed multilayer board, high-frequency microwave board, multi-functional metal substrate, etc.

In the field of communication PCB backplane board, 13 large customers in the world provide about 85% of the demand in this field. The certification of customers takes 2-3 years, and the threshold to enter the high-quality customer supply chain system is very high. At present, ipcb company has obtained the certification of many large-scale high-quality customers, and the top five customers such as mainland automotive electronics account for more than 50% of the company's revenue year after year. The company's supply to several core customers accounts for 10-20%. We believe that ipcb is expected to further increase this proportion to 25-35% by expanding its production capacity.

The projects raised by ipcb will gradually release production capacity. At present, the annual capacity of the company is 1.6 million square meters, and the capacity utilization rate has been maintained at a high level. It is estimated that the annual capacity utilization rate of this year will be more than 90%, which is basically full load production. The 750000 square meter HDI PCB expansion project in the project raised by ipcb company is currently in the stage of plant infrastructure construction. We expect to complete the construction of Q3 plant this year, carry out trial production in Q1 next year, and start to release production capacity in Q2 and Q3 next year. The 117300 3G communication high-end system PCB technology upgrading project invested by the fund mainly includes the reconstruction and expansion of the existing production line and the purchase of equipment. At present, a small part of the production capacity has been released, and we expect that the full release of the production capacity will be in the second half of next year.