Laird Tflex360 Tflex 300 

Thermal Gap Filler

Laird Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a

thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.

Laird Tflex 300H is offered with a hard, metallized liner option for easy handling and improved

rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts

that must slide together, such as a card into a chassis.

Laird Tflex 300TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a

guaranteed dielectric barrier, and easier part handling for mass production.

FEATURES AND BENEFITS

• Extreme compliancy allows material to “totally blanket” components

• Thermal conductivity of 1.2 W/mK

• Low compression set enables the pad to be reused many times

• Environmentally friendly solution that meets regulatory requirements including RoHS and

REACH