Features and Benefits 

1. Thermal conductivity: 2.0 W/m-K

2. Ultra-conforming; designed for fragile  and low-stress applications 

3.Ambient and accelerated  cure schedules 

4.100% solids – no cure by-products

5. Excellent low- and high-temperature  mechanical and chemical stability

 

 

 

BERGQUIST GAP FILLER TGF 2000 is a  high performance, thermally conductive,  liquid gap-filling material supplied

 as  a two-component, room or elevated  temperature curing system. 

The material  provides a balance of cured material  properties and good compression set  (memory). 

The result is a soft, form-inplace elastomer ideal for coupling “hot”  electronic components mounted on PC  

boards with an adjacent metal case or  heat sink. Before cure, it flows under  pressure like grease. After cure, 

it won’t  pump from the interface as a result of  thermal cycling and is dry to the touch.  Unlike cured gap-filling materials, 

the  liquid approach offers infinite thickness  variations with little or no stress  during displacement and assembly. 

BERGQUIST GF2000  also eliminates the need for specific  pad thickness and die-cut shapes for  individual applications. 

BERGQUIST GAP FILLER 2000 is  intended for use in thermal interface  applications when a strong structural  bond is not required.

 

BERGUQIST TGF 2000 Typical Applications Include: 

1.Automotive electronics 

2.Computers and peripherals 

3. Between any heat-generating semiconductor and a heat sink

4. Telecommunications 

5.Thermally conductive vibration dampening 

 

GAP FILLER TGF 2000 Configurations Available: 

1. Supplied in cartridge or kit form