Semiconductor package base plate

Semiconductor package base plate
Model:-
Brand:-
Origin:Made In China
Category:Electronics & Electricity / Other Electrical & Electronic
Label: -
Price: US $0.1 / pc
Min. Order:30 pc

Product Description

It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3,BeO)、Semiconductors (Si)、Metals (Kovar),etc. The products are widely applicated in the fields such as radio frequency、microwave、high power diode packaging and optical communication system.
 
Features:
High thermal conductivity due to use of pure W and pure Cu without sintering additives
Coefficient of thermal expansion matching that of ceramic and semiconductor materials
Excellent hermeticity due to over 99% relative density
High hardness, much more tough than pure copper
 
Production information

Type Composition Properties
Density CTE,
ppm/K
TC,
W/m.K
element Content,
wt-%
Mass density,
g/cc
Relative density,
%T.D.
W90Cu W
Cu
90±1
balance
17.0 ≥99 5.6~6.5 190~200
W85Cu W
Cu
85±1
balance
16.3 ≥99 6.3~7.0 200~210
W80Cu W
Cu
80±1
balance
15.4 ≥99 7.6~9.1 220~230
W50Cu W
Cu
50±1
balance
12.3 ≥99 12.3~12.8 230~240
 

 

Contact: Sandy +86-15200938465

Payment Terms:TT
Semiconductor package base plate 1

Member Information

Changsha Saneway Electronic Materials Co., Ltd
Country/Region:Hu Nan - China
Business Nature:Manufacturer
Phone:15200938465
Contact:Sandy Yu Xiao yan (Sales supervisor)
Last Online:23 Feb, 2022