Features：Polycrystalline diamond lapping slurry formulated with PCD Powder and water/oil soluble carrier liquids to maximize cutting and polishing efficiency provides high removal rate, less scratches, stable grinding rate and uniform polishing surface. We can also customize slurry as per specific requirement by customers.

Applications: Suitable for precision polishing of sapphire, hard disk, magnetic head and other materials.

Available granularity：0.5 to 16.