Model: | DB291 |
---|---|
Brand: | Low Temperature Curing Adhesive |
Origin: | Made In China |
Category: | Chemicals / Adhesives & Sealants |
Label: | DOCBOND |
Price: |
¥200
/ pc
|
Min. Order: | 20 pc |
DB291
This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a very short time. The product has excellent working performance and high storage stability. This product is suitable for low-temperature curing process, mainly used for bonding heat-sensitive components,suitable for memory cards, CCD/CMOS, LED backlights etc.
Payment Terms: | TT |
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HUIZHOU DOCBOND NEW MATERIAL CO.,LT | |
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Country/Region: | Guang Dong - China |
Business Nature: | Manufacturer |
Phone: | 18927329853 |
Contact: | Qingdao Docbond New (Marketing Director) |
Last Online: | 18 Apr, 2023 |