DOCBOND|Low Temperature Curing Adhesive

DOCBOND|Low Temperature Curing Adhesive
Model:DB291
Brand:Low Temperature Curing Adhesive
Origin:Made In China
Category:Chemicals / Adhesives & Sealants
Label:DOCBOND
Price: ¥200 / pc
Min. Order:20 pc

Product Description

DB291

This product is a single component, low temperature fast heat curing  modified epoxy resin adhesive. Excellent adhesion between many different  types of materials at lower temperatures and in a very short time. The  product has excellent working performance and high storage stability. This product is suitable for low-temperature curing process, mainly used  for bonding heat-sensitive components,suitable for memory cards,  CCD/CMOS, LED backlights etc.

Payment Terms:TT
DOCBOND|Low Temperature Curing Adhesive 1DOCBOND|Low Temperature Curing Adhesive 2DOCBOND|Low Temperature Curing Adhesive 3

Member Information

HUIZHOU DOCBOND NEW MATERIAL CO.,LT
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:18927329853
Contact:Qingdao Docbond New (Marketing Director)
Last Online:18 Apr, 2023