Diamond Dicing Blade for motherboard grooving

Diamond Dicing Blade for motherboard grooving
Model:1A1R
Brand:MoreSuperHard
Origin:Made In China
Category:Industrial Supplies / Tools / Abrasives
Label:PCD Dicing blade , Diamond Dicing blade , Groove Dicing blades
Price: US $30 / pc
Min. Order:5 pc

Product Description

 

Brief Introductions:

 

Type:

1A1R

Bond:

Resin or Metal

Application:

Glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN copper epoxy molding ), splitter, sapphire

Specification:

Customized

Brand Mark:

Moresuperhard

Trade Terms:

FOB

Packages:

Hard carton

Delivery Time:

15 workdays by express

 

 

Introductions of Moresuperhard’s Dicing Blades

 

Diamond dicing blade is sintered from a combination of diamond powders and bonds. It comes with excellent form holding characteristics, and an extremely high wear resistance, is used for cutting and slotting of electronic and optical components.

 

D(mm)

T(mm)

U(mm)

H(mm)

X(mm)

4” /100

0.5, 0.6, 0.8, 1.0, 1.2, 1.5

0.4, 0.5, 0.6, 0.8, 1.0, 1.3.

20, 31.75

5, 10

5”/ 125

0.5, 0.6, 0.8, 1.0, 1.2, 1.5

0.4, 0.5, 0.6, 0.8, 1.0, 1.3

20, 31.75

5, 10

6”/ 150

0.6, 0.8, 1.0, 1.2, 1.5, 1.8

0.5, 0.6, 0.8, 1.0, 1.3, 1.6

20, 31.75

5, 7, 10

8”/ 200

 0.8, 1.0, 1.2, 1.5, 1.8

0.6, 0.7, 0.8, 0.9, 1.1, 1.2, 1.4, 1.5.

20, 31.75

5, 7, 10

12”/ 300

1.0, 1.2, 1.4, 1.5, 1.7, 1.8

0.7, 0.9, 1.1, 1.4

20, 31.75

5, 7, 10

16”/ 400

1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3

0.9, 1.2, 1.4, 1.6, 2.0

20, 31.75

5, 7, 10

20”/ 500

1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3

0.9, 1.2, 1.4, 1.6, 2.0

20, 31.75

5, 7, 10

Other size can be made according to customers’ requirement

 

Detailed Specifications can be customized!

 

Advantages of Moresuperhard’s Dicing Blades

 

– Excellent cutting ability that help reduce chipping, fractures and achieve smooth surface finish

– Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc.

– Able to precisely control diamond concentration to achieve cutting quality

– Self sharpening matrix to expose new diamonds. Diamond grit size ranges from 3μm to 250μm depending on blade thickness

 

Diamond Dicing Blade for motherboard grooving 1Diamond Dicing Blade for motherboard grooving 2Diamond Dicing Blade for motherboard grooving 3Diamond Dicing Blade for motherboard grooving 4Diamond Dicing Blade for motherboard grooving 5

Member Information

Henan MoreSuperHard Products Co Ltd.
Country/Region:Taiwan, China
Business Nature:Manufacturer
Phone:86545906
Contact:Jason Guo (Sales)
Last Online:17 May, 2023