GENESYS-AUTO 3D AOI combines maximum defect detection, automotive electronics specificity and cost effectiveness. It combines 2D and 3D inspection. Five (5) 15MP CoaXPress color cameras are combined with MIRTEC's unique 12-projection digital blue moiré technology. The anti-reflective technology is specifically designed to inspect reflective objects, especially solder joints in high-end electronics manufacturing industries such as automotive electronics, aerospace and defense. Due to the relatively high standards of 3D inspection in these areas, other 3D AOI systems with traditional 3D technology have str led to meet these advanced inspection requirements.

MIRTEC 3D AOI GENESYS-AUTO Series Features:

∎ Part inspection up to 50㎜ height
●MIRTEC's proprietary hybrid 3D inspection technology, which provides uniformly accurate measurements over the entire 3D measurable range, independent of external factors such as PCB density and material properties.
●Inspects parts with a height of 50㎜ by moving the Z-axis of the optical system.
●Intelligent inspection software based on artificial intelligence deep learning methods
∎Compression pin, single pin, pin array, fork pin, connector pin inspection
∎Available for both Pin part and SMD part inspection
∎Side-by-Side® : Simultaneous inspection on 5 sides using 18 Megapixel side-by-side camera.
∎ Artificial Intelligence : MIRTEC's Total Remote Management System (TRMS) is a fully integrated Industry 4.0 solution that combines remote management with real-time data monitoring and analysis of every system within the SMT line.
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