High Thermal Conductive Silicon Sheet Thermal Pad For Auto Equipment

TIF300series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features of  Thermal Pad

> High thermal conductivity, heat transfer coefficient 4.6W/m-k.
> Moldability for complex parts.
> Soft and compressible for low stress applications.
> Naturally tacky needing no further adhesive coating.
> Available in varies thicknesses.

Applications of thermal pad

> Car engine module and vehicle electronic equipment 
> Notebook computer, table computer CPU 
> Flat panel TV, mobile equipment, high-speed hard disk driver 
> Semiconductor and the radiating fin between 
> Computer, PC server, workstation 
> LED lighting device and mass storage device 

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

FAQ:

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China 

Q: How long is your delivery time? 

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity. 

Q: Do you provide samples ? is it free or extra cost? 

A: Yes, we could offer samples free of charge