XinZhiZao XZZ-08L 0.8L Ultrasonic Cleaner 50W Desktop Stainless Steel Cleaning Box For Phone Motherboard/Camera/CPU/BGA Chip/Glasses/Electronic Parts Cleaning. XZZ-08L 0.8L ultrasonic cleaning machine 360℃ deep cleaning, suitable for dust removal/oil removal/wax removal/rosin removal of mobile phone motherboard IC chips, etc.
Features:
1. XZZ-08L Industrial grade vibration head ultrasonic cleaning machine, high frequency strong earthquake 360℃ deep cleaning, for mobile phone motherboard IC chip dust removal/oil removal/wax removal/rosin removal, etc.
2. Ultrasonic cleaning scope of application: Mobile phone motherboards, IC chips, hardware components, glasses, gold jewelry, etc.
3. High frequency vibration forms strong flowing bubbles that collide with gaps and surfaces of objects, causing them to split and fall off.
4. 304 stainless steel inner liner, thickness of 1.1mm, sealed impermeable, one-time stamping, leak proof, seamless.
5. The industrial grade configuration has high strength, strong vibration force, and is cleaner and easier to remove oil stains.
6. The core component "vibration head", made of high-quality piezoelectric ceramic components, carefully designed, processed, and tested. It is an industrial type for bolt fastening, and can produce stable and powerful ultrasonic waves even under load changes.
7. Edge rounding treatment: Smooth edge chamfering to prevent contact and cutting, 304 stainless steel inner liner for safe use.
8. Anti slip silicone foot pads: Thickened and upgraded, stable and wear-resistant.
9. High temperature resistant power cord passed the national 3C certification, safe and reliable.
10. Dust proof heat dissipation hole: Prevent flying dust from entering, reduce failure rate, and achieve.
Specifications:
Model: XinzhiZAO XZZ-08L Ultrasonic Cleaning Machine.
Input voltage: AC220-240V 50HZ/AC100-120 60HZ.
Ultrasonic power: 50W.
Capacity: 0.8L.
Weight: 1.2KG.
Inner groove size: 150x85x65MM.
Overall size: 175x110x125MM.
