High-Performance Liquid Cooling Plates for Data Centers

AMD CPU liquid cooling plate SP5 liquid cooling plate

AMD CPU SP5 liquid cooling plate

The unique heat dissipation design cleverly directs the water cooling liquid to

the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and

heat dissipation performance. Its unique flow path design ensures that the

coolant can flow efficiently.Evenly distributed on each heat dissipation surface,

thereby significantly improving heat dissipation efficiency. Compared with

traditional heat dissipation methods.Heat sinks and fans enhance heat

dissipation more effectively.

Small batch customization with quick proofing

》High thermal conductivity material, precision processing.

》TLP welding, post-processing process.

》Efficient cooling performance, reliability and durability.

》Environmental protection and energy saving.

》Intelligent management, maintainability and flexibility.

Model ：T-HS202301  Category：AMD CPU  

Welding process：pure copper TLP welding  heat source Total power：500W

Working environment：40°C,2LPM,25%EGW   cold plate surface temperature：below 52°C

flow resistance：Below 10KPa   Resistant to stress：1Mpa