Wafer dicing blade

Wafer dicing blade
Model:Dicing blade
Brand:Dicing blade
Origin:Made In China
Category:Industrial Supplies / Tools / Abrasives
Label:Disco Dicing blade , Blade Dicing , Dicing process using
Price: US $1 / pc
Min. Order:1 pc

Product Description

Wafer dicing blade

Main cutting products: Silicon wafers, semiconductor compound wafers (GaAs, GaP, etc.), oxide wafers (LiTaO3, etc.), chip LED substrates, various semiconductor packaging components.

 

Electroplated nickel blade

Main cutting products: silicon wafers, semiconductor compound wafers (GaAs, GaP, etc.), various semiconductor packaging components, various semiconductor packaging components of other materials, unsintered ceramics, brittle and hard materials, other materials PZT, LiTaO3, ceramics, silicon wafers, Other materials composite materials (Si + glass, etc.), ceramics, other materials.

Wafer dicing blade 1Wafer dicing blade 2

Member Information

Achimie Industrial Co., Limited
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:13545976007
Contact:Achimie Industrial (Director)
Last Online:20 Oct, 2024