Polyimide film is Polyimide Polycondensate by polycondensing PMDA and ODA through the process of forming film in strong solvents and then being treated by imine at high temperature. Such film possesses excellent physical, chemical, and electrical properties, which performs successfully in the wide range of temperature as low as -452F(-269c) and as high as +436F(+260c) and can be exposed at +752F(400c) in short time, besides, it is of atomic radiation resistant. Polyimide film is currently the macromolecular compound with the best combined properties and the highest heat resistant.