PCB

Model:	2-24 layer
Brand:	-
Origin:	Made In China
Category:	Electronics & Electricity / Electronic Components / Circuit Board
Label:	PCB , HDI , COB
Price:	-
Min. Order:	100 pc

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Product Description

Technology and Capacities

Description

1 product range 2-24 Layers, HDI, Al Base, COB

2. Base Material FR-4 Glass Epoxy Laminate, Aluminum Based. (others by special order)

3. Major Laminate King Board(KB-6150/60) ShengYi(S1141,S1170) Rogers, High frequency Materials: PTFE, Getek, Nelco( by order)

4. Surface Finish Treatment Flash gold(Electrolytic) Electroless nickel immersion gold(Electroless ni/AU) OSP or Entek

Hot Air Leveling=(HAL-Tin/Lead)

Hot Air Leveling(Lead-free, Rohs)

Carbon Ink, Peelable MASK, Gold Finger. Immersion silver, Immersion Tin

5. Via Holes Copper PTH/Blind Via/ Buried Via/ HDI 2+n+2 with IVH

6. Impedance Control Tol. +/-10%(min (+/-7 Ohm)

7. Solder Mask Liquid Photo-Image(LPI)

8 Profilling CNC Routing, V-Cutting, Punching, Push Back Punching, Connector chamfering

9. Max Board size 610*711mm

10,Mini Board Thickness 0.2mm(2 layers)/0.4mm (4 layerS) 0.9mm(8Layer)/1.2mm(10 layer)1.2mm(10 layers)/1.3mm(12 layers)/1.5mm (14 layers)/1.7mm (16layers) / 1.8mm/2.0mm(18layers)/2.2mm(20layers)/2.4mm(22layersr)/2.6mm(24layers)

11. Copper Foil Thickness 18um/35um/70um-245um( Outer layer 0.5oz-7oz)

18um/35um/70um-210um ( Inner layer:0.5oz-6oz)

12 Min Via size and type Dia 0.15mm( finished)

13. Min line width and spacing 0.1mm/0.10mm(4min/4mil)

14 minimum via hole size and pad via: dia 0.2mm/pad: dia 0.4mm HDI<0.1mm via

15 Minimum Hole Tolerance +/-0.05mm(NPTH) +/-0.076(PTH)

17 Hole to hole edge gap 0.8mm

18. Minimum Tooling Hole Diameter 1.5mm

19. Minimum Legend line width 0.15mm

20 Dimensional Tolerance Pouching :+/-0.1mm PTH(+/- 0.076MM) By drilling, NPTH(+/-0.05mm) by drilling, NPTH(+/-0.1mm) by pouching, Remark:6.00mm hole tolerance by routing is +/-0.13mm

21. Other Dimensions Unless other specified Outline tolerance:+/-0.13mm for routing.+/-0.15mm for punching

22. Minimum Annular Ring The least circular strip plane inner layer/ outer layer—component holes:0.2mm via holes:0.15mm

23.minimum copper trace width the least noticeable width of the conductor in a circuit path on the printed wiring board width spacing :0.18um/0.5oz. 35um/1 oz. 70um/2 oz. Singe Sided:0.15mm, 0.15mm, 0.2mm

24. Minimum Spacing The least distance between adjacent edge of conductors(not-center-to center) on a single layer of a printed wiring board double sided: 0.10/0.13mm 0.13/0.13mm

0.2/0.2m multilayer：0.10/0.13mm 0.13/0.13mm 0.2/0.2mm

25 Minimum SMT Pitch o.4mm

26. Minimum Solder mask double sided 0.25mm. Multilayer:0.25mm

27. Minimum Solder mask Double sided: pad width 0.1mm multilayer:0.075mm

28. Copper to board Gap 0.2mm

29. Copper to Hole Gap 0.2mm

30.minimum void/thermal gaps 0.2mm*0.2mm or diameter=0.5mm

31. Acid Trap Closed 0.2mm

32. Capacity 600000 square feet( month)