Detailed Product Description
Structure:1+c+1/2+c+2
Materials:FR4 H-TG
Copper Thickness:MAX 1OZ
Dielectric Thickness:Max 3 mil
Pattern width/space:max 4mil
Laser drill hole:Max 6mil
Layer:Max 24layer
Impedence control:10%
Drill hole:buried/blind/through hole
Surface treatment:HAL/HAL-LF/ENIG/IMMERSION GOLD/SILVER/TIN/GOLD FINGER ETC
Production:Prototype/mass/sample/quick turn/high mixture low volume
Aluminum base board (Aluminum PCB)
Contact way:
Skype: eg_bruce
Mail: leon.zhang(at)sayfupcb.com
www.sayfupcb.com