Product Description
2D solder paste thickness:
1. laser measurement, solder paste measurement accuracy of 2 microns, SPC statistical management, product management, plane geometry, volume measurement
2.5 file multiple adjustable, powerful software, simple operation
3. Electromagnetic Lock XY mobile platform, with fine-tuning
4. the most sophisticated laser line, for general SMT solder paste measurement and process management
5. to a high degree of precision measuring other artifacts
Specifications:
0.005mm high-precision non-contact laser measurement
The maximum copper thickness can be measured 4mm,
Accuracy: / -0.002
Repeatability / -0.004
Video observation, image storage, data records.
Area / volume / distance / angle measurement of various
Export text, EXCEL, automatic bodyguards printing.
Statistical average, maximum / minimum value, the number of poor, poor rate, skewness, kurtosis, Ca, Cp.Cpk, Pp.Ppk.,
Drawing, preview, print, X-BAR control chart, R Control Chart