Features:

1. Suitable for various of chip repair, using embedded system, PLC interface dialogue, optical alignment system design, display three temperature curve any time, temperature accuracy ±1 degree, touch screen display heating temperature time、slope、cool、alarm;
2. Alignment, mounting, welding and remove automatically;
3. Three independent temperature zone control, more accurate;
4. The first, second and third zone controlled by 9 segment temperature up (down)+9 segment constant temperature, can store N groups temperature curve. Curve analysis and change setting in touch screen any time;
5. Use high-definition CCD vision system, accurate judge the solder melting process when welding and demolition BGA, providing critical visual Aspect
6. After demolition and welding, using high flow constant fan to cool the PCB board, prevent deformation of PCB board to ensure welding effect;
7. Temperature parameter with password protect, to prevent amend arbitrary;
8. Equipped with various size of hot air nozzle, can make according to customers requirement, hot air nozzle can 360 degree rotation, easy to replace.
9. After finish remove and welding BGA, have sound alarm function, automatic alarm and power off when temperature is out of control, with dual over-temperature protection；
10. High-precision K-type thermocouple closed-loop control, external temperature measurement interface to accuracy detect the temperature;
11. The smallest BGA size to repair is 1mm*1mm, biggest is 60mm*60mm, no external gas source, adjust accuracy can be 0.01mm.

SPECIFICATION