Electronic Packaging ultrafine silica powder
| Model: | 2000-6000 |
|---|---|
| Brand: | BO TECH |
| Origin: | Made In China |
| Category: | Metallurgy , Mining & Energy / Metallurgy & Mining / Non-metallic Mineral Products |
| Label: | High purity silica , Ultra fine silica , high grade silica |
| Price: |
¥3000
/ pc
|
| Min. Order: | 1 pc |
Product Description
Bo Tech silica powder company is using local high grage raw materials to produce electronic grade silicon powder used in electronic assembly materials:
① for the led, smd, emc electronic isolation devices, electrical products, electronic packaging materials, the ultra silica powder main role is waterproof, anti-dust, anti-harmful gases, reduce vibration, and stability against external damage circuit. Ultra-fine high purity electronic grade silicon powder is using in large scale integrated circuit boards and electronic packaging materials, raw materials, combined with epoxy resin to complete the bond Sealing chips or components, ultra-fine silicon powder in epoxy resin The mixing ratio of the decision of the board of the thermal expansion coefficient, the higher the proportion of silica powder, therefore, the purity of silicon powder, fine and particle size distribution Electronic materials in the filled epoxy molding heightened purity ultra-fine and nano silica content of 70 ~ 90% with excellent workability, shrinkage is small, thermal expansion coefficient, acid and solvent good insulation and good mechanical properties , and epoxy resin mixed transparency, and electronic packaging materials account for 80% of the epoxy molding compound, organic silicon packaging materials account for 20%.
② electronic substrate materials (electronic ceramics) to add ultra-pure ultra-fine silicon powder can be reduced after the sintering temperature, and can play a two-phase and recovery phase toughening, dense, increase the strength of the effect. The electronic packaging industry, plastic products, basic raw materials.
more info.please contact to Bo Tech
① for the led, smd, emc electronic isolation devices, electrical products, electronic packaging materials, the ultra silica powder main role is waterproof, anti-dust, anti-harmful gases, reduce vibration, and stability against external damage circuit. Ultra-fine high purity electronic grade silicon powder is using in large scale integrated circuit boards and electronic packaging materials, raw materials, combined with epoxy resin to complete the bond Sealing chips or components, ultra-fine silicon powder in epoxy resin The mixing ratio of the decision of the board of the thermal expansion coefficient, the higher the proportion of silica powder, therefore, the purity of silicon powder, fine and particle size distribution Electronic materials in the filled epoxy molding heightened purity ultra-fine and nano silica content of 70 ~ 90% with excellent workability, shrinkage is small, thermal expansion coefficient, acid and solvent good insulation and good mechanical properties , and epoxy resin mixed transparency, and electronic packaging materials account for 80% of the epoxy molding compound, organic silicon packaging materials account for 20%.
② electronic substrate materials (electronic ceramics) to add ultra-pure ultra-fine silicon powder can be reduced after the sintering temperature, and can play a two-phase and recovery phase toughening, dense, increase the strength of the effect. The electronic packaging industry, plastic products, basic raw materials.
more info.please contact to Bo Tech
| Payment Terms: | TT / LC / DP / DA |
|---|---|
Member Information
| Lianyungang Bo-tech Silica Powder Co.,Ltd | |
|---|---|
| Country/Region: | Jiang Su - China |
| Business Nature: | Manufacturer |
| Phone: | 15312127633 |
| Contact: | Mr.Lee (Manage Director) |
| Last Online: | 22 Nov, 2016 |
