ASML 5500/850 B and /850 C scanners steppers
Manufacturer:ASML
Model: ASML 5500/850B and ASML 5500/850C
Condition: The ASML 5500 850B and ASML 5500 850C steppers are currently in the yellow room at a North American fab site, under power and ready for inspection and demonstration.ASML documentation and services are available.
Price term: A formal proposal including terms and financing for the ASML 5500 850 B and ASML 5500 850 C steppers can be forwarded after your review and discussion.
ASML 5500-850C, 248nm Scanner
Cymer Laser Model 6610.
SECS.
ARMS.
Single-Reticle-SMIF
PEP-1 Productivity Upgrade.
Recicle Error Compensation.
Flatness Model.
LSQ Disto Model.
Mark Sensor.
Batch Streaming.
Focus Monitoring.
Aerial.
Focal Adjustment.
Reticle CD Control.
Extended Exposure.
TIS.
Athena.
Automated Doe Exchanger.
Laser 2KHZ.
Wafer Handling-2.
Phase Modulator OA.
Variable Laser Freq Cntrl.
Reticle Blue Align.
Level Sensor, 8 Spots.
Circuit Dependent FEC.
WS to RS Improvement.
Zero First Optimisation.
Multi Image Job.
Speed Up Rema X.
Step Improvement Q101.
Static Leveling Method.
Reticle Cooling.
PEP Wafer Swap-1.
WS, RS Idle Mode Park.
Support HPMCA.
PEP Step & Expose-1
PEP Step & Expose-2
PEP Level Alignment-2
PEP Level Alignment-3
PEP Wafer Swap-3.
PEP Step & Expose-4.
PEP Level Alignment-4
Alignment Reports.
REMA Arch-B.
Wafer Handling-6.
Shifted Measurement Scan.
Inline Q above P.
Alignment Grid Accuracy.
Athena Focus IMPR-1.
CT Global Correction IMPR-1.
TIS Repro IMPR-1
Prealigner Wafer Cooling.
Static Exposures.
Echuck Flatness Qualification.
Athena Allow Red Only.
PEP Batch Overhead Reduction.
Advanced XPOL Algorithm.
Shifted Measurement Scan-2.
Annular Illumination.
Athena Allow High Orders.
Scribelane Marks.
Library Config-2.
Library Config-3.
Reticle Cooling Per Layer.
Visual Alignment Camera
Wafer Table Cleaning.
Unicom/Does Mapper.
High Speed Stage.
ASML 5500-850B, 248nm Scanner
Cymer Laser Model 6610.
SECS.
ARMS.
Single-Reticle-SMIF
PEP-1 Productivity Upgrade.
Recicle Error Compensation.
Flatness Model.
LSQ Disto Model.
Mark Sensor.
Batch Streaming.
Focus Monitoring.
Aerial.
Focal Adjustment.
Reticle CD Control.
Extended Exposure.
TIS.
Athena.
Automated Doe Exchanger.
Laser 2KHZ.
Wafer Handling-2.
Phase Modulator OA.
Variable Laser Freq Cntrl.
Reticle Blue Align.
Level Sensor, 8 Spots.
Circuit Dependent FEC.
WS to RS Improvement.
Zero First Optimisation.
Multi Image Job.
Speed Up Rema X.
Step Improvement Q101.
Static Leveling Method.
Reticle Cooling.
PEP Wafer Swap-1.
Leveling Offset Profile.
WS, RS Idle Mode Park.
Support HPMCA.
PEP Step & Expose-2
PEP Level Alignment-2
PEP Level Alignment-3
PEP Wafer Swap-3.
Wafer Handling-4.
PEP Level Alignment-4
Alignment Reports.
Shifted Measurement Scan.
Inline Q above P.
Alignment Grid Accuracy.
Athena Focus IMPR-1.
CT Global Correction IMPR-1.
TIS Repro IMPR-1
Prealigner Wafer Cooling.
Static Exposures.
Echuck Flatness Qualification.
Athena Allow Red Only.
Advanced XPOL Algorithm.
Annular Illumination.
Athena Allow High Orders.
Scribelane Marks.
Library Config-2.
Library Config-3.
Visual Alignment Camera
Wafer Table Cleaning.
Litho Cool.