Features:

1. Two independent heating zones, multitude temperature zones control, lead free process.
2. Top heating zone use to infrared.
3. The bottom zone applies to far infrared to pre-heating to prevent PCB curve.
4. Six-section temperature controls, simulates re-flower effect completely.
5. Cools PCB after heating, to prevent PCB deflection.
6. BGA welding on completion of the demolition, a voice prompt
7. Vacuum wand sucks BGA, convenient, reliable and durable
8. Card board with a special tooling for a wide variety of notebook motherboard(option )
9. COM connection, connect with computer to achieve hi-end rework function.

Specification:

Thickness 0.5~4mm
PCB Size MAX 250mmW*200mmL
Heating/Consumption(Upper) IR /300W Heating/Consumption(Bottom) IR/1200W
Control Have COM ,can connect PC Max Consumption 1.6KW Power 220V OR 380V OR 110V Dimension 30mmL X 400mmW X 300mmH
Weight 14Kg Packet Carton
Warranty: one year