Product

Single sided to 12 layers PCB

Material

FR1, FR2, CEM1, CEM3, FR4, BT

Board thickness

0.4mm to 3.2mm

Base copper

H oz to 6oz

Min. hole size

Min LW/LS

0.3mm

0.1mm(Flash Gold)/0.15mm(HASL)

Aspect ratio

1 : 6

Soldermask

LPI type, Baked type, Peelable mask

Surface finishing

HASL, Flash gold, Immersion gold, Gold finger, Carbon ink

Max. panel size

508mm x 610mm

Bow & twist

0.7% (1.5mm board)

Hole size tol.

PTH: +/-0.08mm, NPTH: +/-0.05mm

Hole location tol.

+/-0.05mm

Gold thickness

0.05um to 1.5um

Nickel thickness

1um to 5um